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Proceedings Paper

Modeling of microsystem flow sensor based on thermal time-of-flight mode
Author(s): Ihsan Hariadi; Hoc-Khiem Trieu; Holger Vogt
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Paper Abstract

This paper reports the results of the modeling silicon microsystem flow sensor based on Thermal Time-Of-Flight (TTOF) mode. The basic heat transfer equations and the modeling approach are first presented. The problem domain is decomposed into two subdomains which represent the fluid and the sensor chip structure, respectively. The thermal boundary layer where the interaction between the two subdomains is taking place is modeled using flow-dependent equivalent thermal resistance elements. The two subdomains and the boundary layer are subsequently implemented using the combination of SPICE and analog HDL. An experimental chip of silicon thermal flow sensor is used to validate the present model. The model has been used to predict the behavior of the flow sensor in free-running TTOF mode and also in Thermal-Convection Delay-Line Oscillator (TC-DLO) mode. Both the agreement and discrepancy found between the model and the experiments are shown and discussed.

Paper Details

Date Published: 19 April 2002
PDF: 14 pages
Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); doi: 10.1117/12.462798
Show Author Affiliations
Ihsan Hariadi, Inter Univ. Research Ctr. (Indonesia)
Hoc-Khiem Trieu, Fraunhofer-Institut fuer Mikroelectronische Schaltungen und Systeme (Germany)
Holger Vogt, Fraunhofer-Institut fuer Mikroelectronische Schaltungen und Systeme (Germany)


Published in SPIE Proceedings Vol. 4755:
Design, Test, Integration, and Packaging of MEMS/MOEMS 2002

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