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Proceedings Paper

Novel technique for microscopic imaging (quality control) of silicon wafers
Author(s): Vladislav V. Yakovlev; Katerina Mikhailchenko; Michael Ravkin
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Paper Abstract

We propose and experimentally demonstrate a fluorescent imaging technique for surface quality control of wet-cleaned silicon wafers. This simple technique allows macro- and microscopic imaging. Submicron resolution and fast scanning are successfully demonstrated. Distribution of water stains is measured using this novel technique and correlated to the surface structure.

Paper Details

Date Published: 8 March 2002
PDF: 6 pages
Proc. SPIE 4664, Machine Vision Applications in Industrial Inspection X, (8 March 2002); doi: 10.1117/12.460188
Show Author Affiliations
Vladislav V. Yakovlev, Univ. of Wisconsin/Milwaukee (United States)
Katerina Mikhailchenko, Lam Research, Inc. (United States)
Michael Ravkin, Lam Research, Inc. (United States)

Published in SPIE Proceedings Vol. 4664:
Machine Vision Applications in Industrial Inspection X
Martin A. Hunt, Editor(s)

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