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Proceedings Paper

Quantitative thermal nondestructive evaluation using an uncooled microbolometer infrared camera
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Paper Abstract

Recent advances in uncooled microbolometer detector arrays has resulted in low cost, small size/weight, and low power consumption infrared cameras. The purpose of this paper is to assess the capabilities of the new microbolometer infrared cameras for quantitative thermal nondestructive evaluation. The camera assessed is a 160 x 128 uncooled microbolometer sensor array operating in the long wavelength infrared band (7.5 to 13.5 microns). The camera size is 4.32 H x 4.32 W X 10.92 L centimeters. Quantitative thermal diffusivity and thickness images obtained by minimizing the squared difference between the data and a thermal model on samples with fabricated defects are presented. The results are compared to conventional thermal imaging cameras using cooled focal plane array detectors. The advantages of a synchronized electronic shutter system (SESS) to remove the heat lamp influence during and after flash heating will also be discussed for these uncooled microbolometer detector arrays.

Paper Details

Date Published: 15 March 2002
PDF: 8 pages
Proc. SPIE 4710, Thermosense XXIV, (15 March 2002); doi: 10.1117/12.459614
Show Author Affiliations
Joseph N. Zalameda, Army Research Lab. (United States)
William P. Winfree, NASA Langley Research Ctr. (United States)

Published in SPIE Proceedings Vol. 4710:
Thermosense XXIV
Xavier P. Maldague; Andres E. Rozlosnik, Editor(s)

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