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Proceedings Paper

Improved yield with SMIF implementation on ALTA systems
Author(s): Jacob Doushy; Gregory E. Valentin; Paul Geller
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Paper Abstract

The need for higher yields on high-value masks has heightened the mask making industry's sensitivity to mask defects. Decreasing the number of mask defects has necessitated improvements in the material handling throughout the production line, and in particular, from mask writer to mask etcher. Already one of the cleanest mask pattern generating systems in the world, implementing a SMIF material-handling paradigm on the ALTA systems decreased the number of defects attributable to the mask writer. ALTA 3000 through ALTA 3700 systems, configured with the SMIF Material Handling upgrade, allow the user to choose between the use of SEMI standard E100-0200 reticle SMIF pods or legacy magazines for loading and unloading reticles. When using SMIF material handling exclusively in production mask manufacture, the number of observed mask defects dropped measurably. The decreased number of defects on the masks improves turn around time, yield, and can decrease the cost of mask manufacturing. Observed defect data will be presented for an ALTA 3500 system before and after the SMIF upgrade.

Paper Details

Date Published: 11 March 2002
PDF: 8 pages
Proc. SPIE 4562, 21st Annual BACUS Symposium on Photomask Technology, (11 March 2002); doi: 10.1117/12.458320
Show Author Affiliations
Jacob Doushy, Intel Corp. (United States)
Gregory E. Valentin, Etec Systems, Inc. (United States)
Paul Geller, Etec Systems, Inc. (United States)


Published in SPIE Proceedings Vol. 4562:
21st Annual BACUS Symposium on Photomask Technology
Giang T. Dao; Brian J. Grenon, Editor(s)

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