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Proceedings Paper

Characterization of an integrated multibeam laser mask-pattern generation and dry etch processing total solution
Author(s): Alex H. Buxbaum; Melisa J. Buie; Brigitte C. Stoehr; Warren Montgomery; Scott E. Fuller
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Paper Abstract

As mask specifications continually tighten with the ever- present progression of Moore's law, mask manufacturing specifications have become increasingly difficult to achieve. Global process optimization from coast to etch is critical for achieving the required mask performance. As an Applied Materials company, Etec is in a unique position within the maskmaking industry to introduce mask manufacturing solutions that are optimized across a number of process steps. Working with the Applied Materials photomask etch team, Etec's laser mask-patterning group characterized and implemented an integrated process recipe for the deep UV, raster-scan, continuous-wave, laser mask- patterning ALTA 4000 system and the Applied Materials Tetra Photomask Etch System.

Paper Details

Date Published: 11 March 2002
PDF: 15 pages
Proc. SPIE 4562, 21st Annual BACUS Symposium on Photomask Technology, (11 March 2002); doi: 10.1117/12.458309
Show Author Affiliations
Alex H. Buxbaum, Etec Systems, Inc. (United States)
Melisa J. Buie, Applied Materials, Inc. (United States)
Brigitte C. Stoehr, Applied Materials, Inc. (United States)
Warren Montgomery, Etec Systems, Inc. (United States)
Scott E. Fuller, Etec Sysems, Inc. (United States)

Published in SPIE Proceedings Vol. 4562:
21st Annual BACUS Symposium on Photomask Technology
Giang T. Dao; Brian J. Grenon, Editor(s)

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