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Proceedings Paper

Robust and fast OPC approach for metal interconnects of 0.13um logic devices
Author(s): Ji-Soong Park; Dong-Hyun Kim; Chul-Hong Park; Yoo-Hyon Kim; Moon-Hyun Yoo; Jeong-Taek Kong; Hyun-Woo Kim; Sun-Il Yoo
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Paper Abstract

Insufficient metal overlaps over contacts and/or vias impact serious yield loss especially in the borderless-contact- style random logic devices. Vias which are not fully covered by interconnects cause not only the functional error due to the high via resistance but also the reliability problem such as electro migration. It is not sufficient to compensate only optical proximity effects such as line-end shortening and corner rounding for the overlap margin. Since mis-alignment between interconnects and over/underlying features is not negligible even using an advanced alignment system of step and scanner. Therefore, the need for aggressive OPC is increased to cope with the proximity effect and overlay error in metal interconnects. The proposed OPC approach gives a robust metal overlap with fast runtime and allowable data complexity by selective correction for the improperly overlapped contacts and vias. Experimental results for the test design show that the correction time of the metal interconnects takes 11 hours at HP5600 system by applying the proposed correction algorithm.

Paper Details

Date Published: 11 March 2002
PDF: 8 pages
Proc. SPIE 4562, 21st Annual BACUS Symposium on Photomask Technology, (11 March 2002); doi: 10.1117/12.458275
Show Author Affiliations
Ji-Soong Park, Samsung Electronics Co., Ltd. (South Korea)
Dong-Hyun Kim, Samsung Electronics Co., Ltd. (South Korea)
Chul-Hong Park, Samsung Electronics Co., Ltd. (South Korea)
Yoo-Hyon Kim, Samsung Electronics Co., Ltd. (South Korea)
Moon-Hyun Yoo, Samsung Electronics Co., Ltd. (South Korea)
Jeong-Taek Kong, Samsung Electronics Co., Ltd. (South Korea)
Hyun-Woo Kim, Samsung Electronics Co., Ltd. (South Korea)
Sun-Il Yoo, Samsung Electronics Co., Ltd. (South Korea)


Published in SPIE Proceedings Vol. 4562:
21st Annual BACUS Symposium on Photomask Technology
Giang T. Dao; Brian J. Grenon, Editor(s)

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