Share Email Print
cover

Proceedings Paper

Multibeam high-resolution die-to-database reticle inspection
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

A new die-to-database reticle inspection system has been developed to meet the production requirements for 130nm node 4x reticles, as well as, the early inspection requirements for 100nm node 4x reticles. This new system is based on the TeraStarT platform1 developed recently by KLA-Tencor Corporation for high performance die-to-die and STARlightT inspection of 130nm node reticles. The TeraStar platform uses high-NA triple-beam scanning laser optics for high throughput. The platform also includes a new generation of defect detection algorithms and image processing hardware to inspect, with high sensitivity and low false detections, the small linewidths, aggressive OPC, and advanced EPSM 4x reticles characteristic of the 130nm node. The platform further includes the TeraProTM concurrent STARlight and die-to-die inspection mode for exceptional productivity. The necessary database elements have now been developed and added to the TeraStar platform, to give it die-to-database inspection capability. A new data format along with new data preparation, data rendering, and data modeling algorithms have been developed to allow high precision database matching with the optical image for exceptional die-to-database performance. The TeraPro high productivity features of the TeraStar platform have been extended to the die-to-database mode providing the opportunity to use STARlight and die-to-database modes concurrently.

Paper Details

Date Published: 11 March 2002
PDF: 11 pages
Proc. SPIE 4562, 21st Annual BACUS Symposium on Photomask Technology, (11 March 2002); doi: 10.1117/12.458271
Show Author Affiliations
William Waters Volk, KLA-Tencor Corp. (United States)
William H. Broadbent, KLA-Tencor Corp. (United States)
Hector I. Garcia, KLA-Tencor Corp. (United States)
Sterling G. Watson, KLA-Tencor Corp. (United States)
Phillip Lim, KLA-Tencor Corp. (United States)
Wayne E. Ruch, KLA-Tencor Corp. (United States)


Published in SPIE Proceedings Vol. 4562:
21st Annual BACUS Symposium on Photomask Technology
Giang T. Dao; Brian J. Grenon, Editor(s)

© SPIE. Terms of Use
Back to Top