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Proceedings Paper

High-resolution thermal imager with a field-of-view of 112 degrees
Author(s): Tadashi Matsushita; Hiroshi Suzuki; Satoshi Wakabayashi; Toru Tajime
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Paper Abstract

A thermal imager with a full field of view (FOV) of 112 deg has been developed. An F/1.2 optics with a cold aperture stop and a 512 X 512 element PtSi Schottky-barrier focal plane array (FPA) is used. The influence of internal radiation and ghost images on the performance of the thermal imager has been modeled and analyzed. Experimental results have demonstrated that this imager can be used without saturation even at the ambient temperature above 60 degree(s)C, and the solar radiation incident will not affect image quality significantly. Examples of imagery obtained with high angular resolution less than 4 mrad are also presented. From these results, it has been clarified that the presented models are effective for analyzing the thermal imager performance.

Paper Details

Date Published: 1 September 1991
PDF: 8 pages
Proc. SPIE 1488, Infrared Imaging Systems: Design, Analysis, Modeling, and Testing II, (1 September 1991); doi: 10.1117/12.45817
Show Author Affiliations
Tadashi Matsushita, Mitsubishi Electric Corp. (Japan)
Hiroshi Suzuki, Mitsubishi Electric Corp. (Japan)
Satoshi Wakabayashi, Mitsubishi Electric Corp. (Japan)
Toru Tajime, Mitsubishi Electric Corp. (Japan)

Published in SPIE Proceedings Vol. 1488:
Infrared Imaging Systems: Design, Analysis, Modeling, and Testing II
Gerald C. Holst, Editor(s)

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