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Proceedings Paper

Three-dimensional analysis framework and measurement methodology for imaging system noise
Author(s): John A. D'Agostino; Curtis M. Webb
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Paper Abstract

Modern imaging sensors incorporate complex focal plane architectures and sophisticated post- detector processing. These advanced technical characteristics create the potential for multi- component noise generation which can exhibit effects temporally as well as along the vertical and horizontal image directions. Such complex three-dimensional (time, vertical, horizontal) noise cannot be adequately treated by previous mathematical analyses developed for simpler system designs where detector noise was predominant. In a parallel sense, earlier methods for noise measurement are no longer satisfactory. A new methodology has been developed at C2NVEO to characterize the noise patterns exhibited by advanced thermal imaging systems. The methods represents a significant expansion of the standard techniques to characterize thermal system noise. This paper explains the principles behind the 3-D noise methodology and the methods used. It also describes how this methodology is implemented in a laboratory measurement environment.

Paper Details

Date Published: 1 September 1991
PDF: 12 pages
Proc. SPIE 1488, Infrared Imaging Systems: Design, Analysis, Modeling, and Testing II, (1 September 1991); doi: 10.1117/12.45794
Show Author Affiliations
John A. D'Agostino, U.S. Army Ctr. for Night Vision and Electro-Optics (United States)
Curtis M. Webb, U.S. Army Ctr. for Night Vision and Electro-Optics (United States)


Published in SPIE Proceedings Vol. 1488:
Infrared Imaging Systems: Design, Analysis, Modeling, and Testing II
Gerald C. Holst, Editor(s)

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