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Proceedings Paper

Laser marking on IC package by micro-encapsulated tapes
Author(s): Kaidong D. Ye; Chengwu An; Yuan Yuan; Yongfeng Lu
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Paper Abstract

In this paper, we are reporting a new way to do marking on IC package. In this way, white ink is wrapped in microcapsules that are coated on a transparent tape. Laser is irradiated on the tape surface, the microcapsules are broken and the ink is released onto the IC package surface. After an UV light treatment, the ink will stick on the IC surface, forming a high contrast marking. It is found that the quality of the marking depends on tape configuration, tape-IC distance, laser peak power, scan speed of laser irradiation and other laser parameters.

Paper Details

Date Published: 25 February 2002
PDF: 4 pages
Proc. SPIE 4426, Second International Symposium on Laser Precision Microfabrication, (25 February 2002); doi: 10.1117/12.456892
Show Author Affiliations
Kaidong D. Ye, Data Storage Institute (Singapore)
Chengwu An, Data Storage Institute (Singapore)
Yuan Yuan, Data Storage Institute (Singapore)
Yongfeng Lu, Data Storage Institute (United States)

Published in SPIE Proceedings Vol. 4426:
Second International Symposium on Laser Precision Microfabrication
Isamu Miyamoto; Yong Feng Lu; Koji Sugioka; Jan J. Dubowski, Editor(s)

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