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Proceedings Paper

High-speed microvia formation with UV solid state lasers
Author(s): Corey M. Dunsky; Hisashi Matsumoto; Glenn Simenson
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Paper Abstract

Laser drilling has emerged in the last five years as the most widely accepted method of creating microvias in high- density electronic inter connect and chip packaging devices. Most commercially available laser drilling tools are currently based on one of two laser types: far-IR CO2 lasers and UV solid state lasers at 355 nm. While CO2 lasers are recognized for their high average power and drilling throughput, UV lasers are known for high precision material removal and their ability to drill the smallest vias, with diameters down to about 25-30 micrometers now achievable in production. This paper presents a historical overview of techniques for drilling microvias with UV solid state lasers. Blind and through via formation by percussion drilling, trepanning, spiralling, and image projection with a shaped beam are discussed. Advantages and range of applicability of each technique are summarized. Drivers of throughput scaling over the last five years are outlined and representative current-generation performance is presented.

Paper Details

Date Published: 25 February 2002
PDF: 8 pages
Proc. SPIE 4426, Second International Symposium on Laser Precision Microfabrication, (25 February 2002); doi: 10.1117/12.456885
Show Author Affiliations
Corey M. Dunsky, Electro Scientific Industries, Inc. (United States)
Hisashi Matsumoto, Electro Scientific Industries, Inc. (United States)
Glenn Simenson, Electro Scientific Industries, Inc. (United States)

Published in SPIE Proceedings Vol. 4426:
Second International Symposium on Laser Precision Microfabrication
Isamu Miyamoto; Yong Feng Lu; Koji Sugioka; Jan J. Dubowski, Editor(s)

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