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Proceedings Paper

Development of laser turning using femtosecond laser ablation
Author(s): Atsushi Yokotani; Kosuke Kawahara; Yasunobu Kurogi; Naoyuki Matsuo; Hiroshi Sawada; Kou Kurosawa
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Paper Abstract

Ablation using femtosecond-lasers has taken much attention for micromachining with the advantages of efficient ultra-thin layer peeling without undesirable thermal effects for both opaque and transparent materials. In this work, we have proposed the femtosecond-laser turning based on the fact that femtosecond-laser ablation is a promising technique for excellent surface finishing techniques. The effect of the machining conditions such as focusing condition, energy of laser pulse and plural scanning, on the thickness of peeling layer for various kinds of materials (PMMA, silica glass, silicon, copper and aluminum) have been investigated. As a result, the important information for the laser turning as a practical application of the femtosecond lasers were obtained.

Paper Details

Date Published: 25 February 2002
PDF: 4 pages
Proc. SPIE 4426, Second International Symposium on Laser Precision Microfabrication, (25 February 2002); doi: 10.1117/12.456877
Show Author Affiliations
Atsushi Yokotani, Miyazaki Univ. (Japan)
Kosuke Kawahara, Miyazaki Univ. (Japan)
Yasunobu Kurogi, Miyazaki Univ. (Japan)
Naoyuki Matsuo, Miyazaki Univ. (Japan)
Hiroshi Sawada, NEC Machinery Corp. (Japan)
Kou Kurosawa, Miyazaki Univ. (Japan)


Published in SPIE Proceedings Vol. 4426:
Second International Symposium on Laser Precision Microfabrication
Isamu Miyamoto; Yong Feng Lu; Koji Sugioka; Jan J. Dubowski, Editor(s)

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