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Proceedings Paper

Microstructures formed on silicon wafer by CO2 laser irradiation
Author(s): Weijie Wang; Yongfeng Lu; Chengwu An; Minghui Hong
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Paper Abstract

Laser bumps have been formed on the silicon surface with anisotropic patterns induced by the pulsed CO2 laser under the backside effect conditions. The microstructures are formed with periodic patterns, and vary with the laser parameters. The parallel narrow fringes have period around 2 micrometers , and the fringe orientation is in parallel with the laser polarization direction. The circular fringes with spacing around 1 micrometers appear when the laser energy increase. The fringe patterns were found to be independent on the laser pulses, therefore are re-writable. The bump formation mechanism is considered to be thermal capillary wave effect during the material melting and resolidification processes under laser irradiation. Whereas, the laser absorption may be induced by the hot electrons, or the thermal energy resulting from the laser interaction with the backside coating material.

Paper Details

Date Published: 25 February 2002
PDF: 4 pages
Proc. SPIE 4426, Second International Symposium on Laser Precision Microfabrication, (25 February 2002); doi: 10.1117/12.456859
Show Author Affiliations
Weijie Wang, Data Storage Institute (Singapore)
Yongfeng Lu, Data Storage Institute (United States)
Chengwu An, Data Storage Institute (Singapore)
Minghui Hong, Data Storage Institute (Singapore)

Published in SPIE Proceedings Vol. 4426:
Second International Symposium on Laser Precision Microfabrication
Isamu Miyamoto; Yong Feng Lu; Koji Sugioka; Jan J. Dubowski, Editor(s)

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