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Proceedings Paper

mu-BGA (ball grid array) singulation with a pulsed Nd:YAG laser
Author(s): Kwang-Yeol Baek; Cheon Lee
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Paper Abstract

In a microelectronics industry, the (mu) -BGA singulation system has been studied by mechanical type. However, this has burr and device damage by mechanical stress. So we need to research other systems to solve many problems. There are only a few types of lasers - excimer, CO2, Nd:YAG, copper vapor lasers in use for polymers and metals. In this paper, we have studied minimization of the line-width and surface burning which occur after the singulation process with a pulsed Nd:YAG((lambda) equals532 nm, repetition rate equals10 Hz) laser. The thermal energy of a pulsed Nd:YAG laser is used to cut the copper layer. Especially, the sacrifice layer and N2 blowing are effective in minimizing surface burning. The N2 blowing reduces a laser energy loss by debris and suppresses a surface oxidation. The SEM (scanning electron microscopes), non- contact 3D inspector and high-resolution microscope are used to measure cutting line-width and surface state. The (mu) - BGA threshold energy is 234.1 kJ/cm2 at 50micrometers /s scan speed.

Paper Details

Date Published: 25 February 2002
PDF: 4 pages
Proc. SPIE 4426, Second International Symposium on Laser Precision Microfabrication, (25 February 2002); doi: 10.1117/12.456854
Show Author Affiliations
Kwang-Yeol Baek, Inha Univ. (South Korea)
Cheon Lee, Inha Univ. (South Korea)


Published in SPIE Proceedings Vol. 4426:
Second International Symposium on Laser Precision Microfabrication

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