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Proceedings Paper

Cutting glass by laser
Author(s): Hyoung-Shik Kang; Soon-Kug Hong; Seok-Chang Oh; Jong-Yoon Choi; Min-Gyu Song
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Paper Abstract

In FPD (Flat Panel Display) devices, the diamond wheel has been used to scribe glass by means of mechanical contact which needs grinding and cleaning processes to remove particles, glass chips, surface cracks and sharp edges. In recent years, laser glass technology that is different from the conventional method of cutting glass by melting, has been researched and utilizes cutting glass by thermal shock. Laser glass cutting by thermal shock can produce cracks in glass by surface cooling after laser heating on glass by means of stress slope on glass surface. When this technology is applied in FPD manufacturing devices, it has several advantages compared to conventional methods as follows: a) non-contact glass cutting: almost no glass chip occurs. b) according to circumstances, grinding and cleaning can be omitted. c) system maintenance can be simplified.

Paper Details

Date Published: 25 February 2002
PDF: 4 pages
Proc. SPIE 4426, Second International Symposium on Laser Precision Microfabrication, (25 February 2002); doi: 10.1117/12.456849
Show Author Affiliations
Hyoung-Shik Kang, LG Electronics (South Korea)
Soon-Kug Hong, LG Electronics (South Korea)
Seok-Chang Oh, LG Electronics (South Korea)
Jong-Yoon Choi, LG Electronics (South Korea)
Min-Gyu Song, LG Electronics (South Korea)

Published in SPIE Proceedings Vol. 4426:
Second International Symposium on Laser Precision Microfabrication
Isamu Miyamoto; Yong Feng Lu; Koji Sugioka; Jan J. Dubowski, Editor(s)

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