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Proceedings Paper

Hole drilling of glass-foam substrates with laser
Author(s): Yoshikazu Yoshida; Hiroyoshi Yajima; Yuji Hashidate; Hiroshi Ogura; Shuhei Ueda
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Paper Abstract

Using 10 - 100 msec pulses and a 10.6 micrometers wavelength CO2 laser, focused to a spot size 200 micrometers , we have produced holes into glass-foam substrates. We examine the effect of pulse width on the hole structure and the pile-up around the hole in single-pulse drilling. The height of the pile-up increases 7 - 30 micrometers with increasing the pulse width. The residual melting layer is under 0.5 (mu) m in the hole walls. It seems that the glass-foam substrate is suitable for laser beam machining.

Paper Details

Date Published: 25 February 2002
PDF: 4 pages
Proc. SPIE 4426, Second International Symposium on Laser Precision Microfabrication, (25 February 2002); doi: 10.1117/12.456803
Show Author Affiliations
Yoshikazu Yoshida, Toyo Univ. (Japan)
Hiroyoshi Yajima, Matsushita Electric Industrial Co., Ltd. (Japan)
Yuji Hashidate, Matsushita Electric Industrial Co., Ltd. (Japan)
Hiroshi Ogura, Matsushita Electric Industrial Co., Ltd. (Japan)
Shuhei Ueda, Shin-Etsu Chemical Co., Ltd. (Japan)

Published in SPIE Proceedings Vol. 4426:
Second International Symposium on Laser Precision Microfabrication
Isamu Miyamoto; Yong Feng Lu; Koji Sugioka; Jan J. Dubowski, Editor(s)

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