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Proceedings Paper

Direct micro-transfer molding of perfluorocyclobutyl (PFCB) polymer waveguides
Author(s): Shengrong Chen; Jaime Cardenes; Gregory P. Nordin; Chris M. Topping; Jack J. Jin; Jennifer Thomson; John M. Ballato; Stephen H. Foulger; Dennis W. Smith
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Paper Abstract

Perfluorocyclobutyl (PFCB) polymers and copolymers enjoy a unique combination of properties well suited for optical applications such as high temperature stability, precisely controlled refractive index, low moisture absorption, excellent melt and solution processability, a variable thermoptic coefficient, and low transmission loss at 1300 and 1550 nm. Copolymerization reactions offer tailored thermal and optical properties by simple choice of comonomer. PFCB copolymers can be solution or melt microfabricated via standard methods and can also be processed via micro-transfer molding in photolithographically generated features. Reliable molding of polymer waveguides offers significant potential to reduce photonic integrated circuit (PIC) fabrication costs and enable the realization of compact, integrated subsystems for a variety of applications. Copolymerization chemistry, thermoptic measurements, and initial results on the first micro-transfer molded waveguide structures are presented.

Paper Details

Date Published: 25 November 2002
PDF: 6 pages
Proc. SPIE 4805, Design and Fabrication of Planar Optical Waveguide Devices and Materials, (25 November 2002); doi: 10.1117/12.453928
Show Author Affiliations
Shengrong Chen, Clemson Univ. (United States)
Jaime Cardenes, Univ. of Alabama in Huntsville (United States)
Gregory P. Nordin, Univ. of Alabama in Huntsville (United States)
Chris M. Topping, Clemson Univ. (United States)
Jack J. Jin, Clemson Univ. (United States)
Jennifer Thomson, Clemson Univ. (United States)
John M. Ballato, Clemson Univ. (United States)
Stephen H. Foulger, Clemson Univ. (United States)
Dennis W. Smith, Clemson Univ. (United States)


Published in SPIE Proceedings Vol. 4805:
Design and Fabrication of Planar Optical Waveguide Devices and Materials
Robert A. Norwood, Editor(s)

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