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Proceedings Paper

Technical trends in amorphous-silicon-based uncooled IR focal plane arrays
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Paper Abstract

After the development of an amorphous silicon based uncooled microbolometer technology, LETI and ULIS are now working to facilitate the IR focal plane arrays (IRFPA) integration into equipment in order to address a very large market. Achievement of this goal needs the integration of advanced functions on the focal plane and the decrease of manufacturing cost of IRFPA by decreasing the pixel pitch and simplifying the vacuum package. We present in this paper the new designs for readout circuit and packages which will be used for 320×240 and 160×120 arrays with a pitch of 35μm.

Paper Details

Date Published: 23 January 2003
PDF: 7 pages
Proc. SPIE 4820, Infrared Technology and Applications XXVIII, (23 January 2003); doi: 10.1117/12.453842
Show Author Affiliations
Jean-Luc Tissot, ULIS (France)
Jean-Pierre Chatard, ULIS (France)
Eric Mottin, CEA-LETI (France)

Published in SPIE Proceedings Vol. 4820:
Infrared Technology and Applications XXVIII
Bjorn F. Andresen; Gabor F. Fulop; Marija Strojnik, Editor(s)

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