Share Email Print
cover

Proceedings Paper

Effects of diamond cutting tool's rake angle and edge radius on the diamond turned surface quality
Author(s): Qingliang Zhao; Shen Dong; Ying-Chun Liang; Yi Zhao
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

For the purpose of realizing the brittle material's turning in ductile mode on the basis of optimizing the diamond cutting tool's geometrical parameters, the Linear Elastic Fracture Mechanics and Finite Element Method are applied to stimulate the stress distribution and micro-cracks' propagation in the cutting region generated under different rake angles and edge radius. The cutting experiments on single crystal silicon surface are then conducted to verify the stimulation results, which show that the propagation of micro-cracks can be restrained from atomic-size cracks when utilizing the diamond cutting tools with -15 degree to -25 degree rake angles. As a result of increasing the critical depth of cut value of brittle-ductile transition, the goal of ductile-mode turning can be achieved. In addition, with a smaller cutting edge radius, the turning of brittle material in ductile-mode can be easily realized, resulting in good diamond turned surface quality.

Paper Details

Date Published: 27 December 2001
PDF: 9 pages
Proc. SPIE 4451, Optical Manufacturing and Testing IV, (27 December 2001); doi: 10.1117/12.453647
Show Author Affiliations
Qingliang Zhao, Harbin Institute of Technology (China)
Shen Dong, Harbin Institute of Technology (China)
Ying-Chun Liang, Harbin Institute of Technology (China)
Yi Zhao, Harbin Institute of Technology (China)


Published in SPIE Proceedings Vol. 4451:
Optical Manufacturing and Testing IV
H. Philip Stahl, Editor(s)

© SPIE. Terms of Use
Back to Top