Share Email Print

Proceedings Paper

Low-power system-on-a-chip FPAs
Author(s): Lester J. Kozlowski; M. Loose; Atul B. Joshi; Kadri Vural; Michael P. Buchin
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Rockwell Scientific's 3rd generation FPAs and sensor chip assemblies (SCA) are complete imaging systems-on-chip for IR and visible cameras. They provide 12-bit to 16-bit digital video at very low power consumption in hybrid and monolithic configurations. A 1936 by 1088 i-SoC with 5μm pixel pitch performs stand-alone visible imaging and a related application-specific integrated circuit supports SCAs. The former generates high-definition video at 30 Hz with <30 e-read noise, -80 dB fixed pattern noise and up to 70dB dynamic range at standard 2/3 inch optical format. When coupled to a fiber optic faceplate with micro-channel plate, the i-SoC for HDTV is believed the first for low-light-level HDTV imaging with 12-bit output at <200 mW. The latter, currently being developed to revolutionize space-and ground-based astronomy, is optimized for HAWAII-2RG 2048×2048 FPAs to provide 16-bit video at approximately 10mW for 10 Mbps imaging. The ASIC will help build very large mosaics for next-generation telescope sensors.

Paper Details

Date Published: 23 January 2003
PDF: 10 pages
Proc. SPIE 4820, Infrared Technology and Applications XXVIII, (23 January 2003); doi: 10.1117/12.453565
Show Author Affiliations
Lester J. Kozlowski, Rockwell Scientific Co. (United States)
M. Loose, Rockwell Scientific Co. (United States)
Atul B. Joshi, Rockwell Scientific Co. (United States)
Kadri Vural, Rockwell Scientific Co. (United States)
Michael P. Buchin, Stanford Photonics, Inc. (United States)

Published in SPIE Proceedings Vol. 4820:
Infrared Technology and Applications XXVIII
Bjorn F. Andresen; Gabor F. Fulop; Marija Strojnik, Editor(s)

© SPIE. Terms of Use
Back to Top