Share Email Print

Proceedings Paper

Passively aligned fiber-optic transmitter integrated into LTCC module
Author(s): Mikko Karppinen; Kari Kautio; Mikko Haekkinen; Jonna Haekkilae; Pentti Karioja; Tomi Jouhti; Ari Tervonen; Markku A. Oksanen
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

We studied the possibilities of LTCC (low temperature cofired ceramics) technology to fabricate transmitter arrays equipped with vertical-mounted multimode fiber pigtails. The developed LTCC module can be mounted vertically on a printed-circuit-board (PCB), thus providing small, essentially one-dimensional PCB footprint. The fiber is aligned and supported using a hole structure through the layers, and the surface-emitting source, such as a VCSEL, is flip-chipped on the other side of the substrate. Thus, this kind of module can be used as a detachable electrical interface between the fiber-optic and electronic media. To evaluate the feasibility of the system, a 5-channel transmitter based on a 4-layer LTCC substrate was designed and realized, and mounted vertically on a test board. Each transmitter, sized 5 mm X 5 mm2, included VCSEL and laser-driver chips as well as discrete passives. 62.5/125-micron fibers were used with metallic tubes as strain relieves. Before implementation, the optical alignment tolerances were examined by measurements and simulations, and the tolerances of fiber-mounting holes were evaluated by preparing test structures. The fiber alignment accuracy seemed adequate even for the first transmitter prototypes. Nevertheless, stringent requirements for the LTCC process control are necessary to achieve the needed accuracy.

Paper Details

Date Published: 13 December 2001
PDF: 10 pages
Proc. SPIE 4455, Micro- and Nano-optics for Optical Interconnection and Information Processing, (13 December 2001); doi: 10.1117/12.450448
Show Author Affiliations
Mikko Karppinen, VTT Electronics (Canada)
Kari Kautio, VTT Electronics (Finland)
Mikko Haekkinen, VTT Electronics (Finland)
Jonna Haekkilae, VTT Electronics (Finland)
Pentti Karioja, VTT Electronics (Finland)
Tomi Jouhti, Nokia Research Ctr. (Finland)
Ari Tervonen, Nokia Research Ctr. (Finland)
Markku A. Oksanen, Nokia Research Ctr. (Finland)

Published in SPIE Proceedings Vol. 4455:
Micro- and Nano-optics for Optical Interconnection and Information Processing
Mohammad R. Taghizadeh; Hugo Thienpont; Ghassan E. Jabbour, Editor(s)

© SPIE. Terms of Use
Back to Top