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Proceedings Paper

Electro-optical circuit boards with four-channel butt-coupled optical transmitter and receiver modules
Author(s): Andreas Himmler; S. Bargiel; F. Ebling; Henning Schroeder; H. Franke; G. Spickermann; Elmar Griese; C. Lehnberger; L. Oberender; Andre Koske; Gerd Mrozynski; D. Steck; E. Strake; Walter Suellau
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Paper Abstract

Chip-to-chip interconnects on printed circuit boards within high-speed electronic systems act increasingly as a limiting bottleneck for the achievable system performance, since local processing speed often exceeds the bandwidth capabilities of conventional electrical interconnects. In addition, rising signal frequencies or clock rates also result in increased susceptibility to electromagnetic interference. The well known limitations and problems of electrical interconnects can be overcome with optical interconnects, which have made their way from long haul telecommunication networks to parallel fiber optical modules for board-to-board interconnects within systems. Extending the advantages of optical signal transmission for very short reach interconnect applications, i.e. board or module level interconnects, therefore is a consequent logical step. This paper presents the integration of optical waveguides into conventional printed circuit boards to achieve hybrid electrical-optical boards with high- bandwidth optical interconnects. The realization of such electrical-optical boards is demonstrated with boards containing 4-channel transmitter and receiver modules, utilizing lead-frame based array GaAs-VCSEL and Si-PIN-diode components. The waveguides are manufactured by hot embossing and laminated into the boards within a standard printed circuit board production process. To couple light into and out of the optical waveguides a butt-coupling technique is applied.

Paper Details

Date Published: 13 December 2001
PDF: 10 pages
Proc. SPIE 4455, Micro- and Nano-optics for Optical Interconnection and Information Processing, (13 December 2001); doi: 10.1117/12.450442
Show Author Affiliations
Andreas Himmler, Siemens AG (Germany)
S. Bargiel, Fraunhofer IZM (Germany)
F. Ebling, Fraunhofer IZM (Germany)
Henning Schroeder, Fraunhofer IZM (Germany)
H. Franke, OECA GmbH (Germany)
G. Spickermann, OECA GmbH (Germany)
Elmar Griese, Siemens AG (Germany)
C. Lehnberger, Andus Electronic GmbH (Germany)
L. Oberender, Andus Electronic GmbH (Germany)
Andre Koske, Univ. Paderborn (Germany)
Gerd Mrozynski, Univ. Paderborn (Germany)
D. Steck, Mikropack GmbH (Germany)
E. Strake, Robert Bosch GmbH (Germany)
Walter Suellau, ILFA Feinstleitertechnik GmbH (Germany)

Published in SPIE Proceedings Vol. 4455:
Micro- and Nano-optics for Optical Interconnection and Information Processing
Mohammad R. Taghizadeh; Hugo Thienpont; Ghassan E. Jabbour, Editor(s)

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