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Proceedings Paper

Micromachining of TiNi shape memory alloy by excimer laser ablation
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Paper Abstract

In this paper we investigate excimer laser micromachining of TiNi shape memory alloy using an image projection system as an alternative to photolithographic patterning. We report on the characteristics of material removal by KrF excimer laser induced ablation at 248 nm and the dependence of material removal rates on laser parameters such as fluence and pulse frequency. Fluences at the workpiece using a 10x projection lens were up to 2.5 J cm-2 with pulse repetition rates up to 100Hz. Conventional chrome-on-quartz masks were used for pattern transfer. Material removal mechanisms and rates of material removal are compared with those observed during excimer laser micromachining of polymers and ceramics and limitations on achievable lateral and depth resolution explored. Data obtained by a variety of characterization methods are correlated to assess the effects of laser induced damage.

Paper Details

Date Published: 21 November 2001
PDF: 8 pages
Proc. SPIE 4592, Device and Process Technologies for MEMS and Microelectronics II, (21 November 2001); doi: 10.1117/12.449012
Show Author Affiliations
Sam T. Davies, Univ. of Warwick (United Kingdom)
Erol C. Harvey, Swinburne Univ. of Technology (Australia)
Hengyi Jin, Swinburne Univ. of Technology (Australia)
Jason P. Hayes, Swinburne Univ. of Technology (Australia)
Muralihar K. Ghantasala, Swinburne Univ. of Technology (Australia)


Published in SPIE Proceedings Vol. 4592:
Device and Process Technologies for MEMS and Microelectronics II
Jung-Chih Chiao; Lorenzo Faraone; H. Barry Harrison; Andrei M. Shkel, Editor(s)

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