Share Email Print
cover

Proceedings Paper

Design and fabrication of a movable O-shape microclamper
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

With the demanding of handling micro objects, the development of micro-clamper has emerged. Here an electro-thermally driven micro-clamper with adjustable vertical position is proposed. This micro-clamper is consisted of an adjusting unit and a clamping unit. The adjusting unit formed by two bimorph beams in the longitudinal direction can move the clamping unit vertically. The clamping unit formed by a pair of bimorph beams at the end of the adjusting unit is in the transversal direction. Due to the residual stress difference in the bimorph beams, at initial state, the adjusting unit in the longitudinal direction will bend upward, and the other two bimorph beams will also curl up to become a clamper. When the adjusting unit is heated, the whole device will move downwards. When the clamper unit is heated, two sides of the clamping unit will open up to a waiting state. It is hoped that the capability of adjusting the clamper in vertical position will provide larger operating range for the micro-clamper. The micro-clamper proposed here is batch-fabricated by surface micromachining. The testing results show that the adjusting unit can produce 8micrometers downward displacement at input voltage of 2V and the clamping unit can be fully flattened around 5 V.

Paper Details

Date Published: 21 November 2001
PDF: 6 pages
Proc. SPIE 4592, Device and Process Technologies for MEMS and Microelectronics II, (21 November 2001); doi: 10.1117/12.449007
Show Author Affiliations
Chien-Tai Wu, National Chiao Tung Univ. (Taiwan)
Wensyang Hsu, National Chiao Tung Univ. (Taiwan)


Published in SPIE Proceedings Vol. 4592:
Device and Process Technologies for MEMS and Microelectronics II
Jung-Chih Chiao; Lorenzo Faraone; H. Barry Harrison; Andrei M. Shkel, Editor(s)

© SPIE. Terms of Use
Back to Top