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Proceedings Paper

Influence of patterning geometry on the electrodeposition of microstructures fabricated by laser LIGA
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Paper Abstract

This paper describes recent experimental studies on the effect of patterning geometry on the laser machining parameters and electrodeposition rate of nickel microstructures fabricated using laser LIGA. The effect of shape, size and spacing of features has been studied for structures plated into Laminar AX moulds. In contrast to previous work, which has concentrated on low aspect ratio (< 0.1) geometries or on large (> 1 mm) structures, we specifically address here problems relating to aspect ratios in the range 0.14 - 8.75 and feature sizes of ~ 4 micrometers to 200 micrometers . Mould structures and plated features have been examined using optical, scanning electron and laser scanning confocal microscopy. Results show that for features >50 micrometers , the thickness profile of plated shapes varies by approximately +/- 1 micrometers m over most of the surface area with the edges demonstrating corner rounding with a radius ~ 5 micrometers . Below 20 micrometers in size, thickness profiles become peaked towards the center of a feature. A surface roughness (Ra) of ~ 1.0 micrometers is also observed. The reduction in deposition rate over the 3 hour electroforming process has also been explained in terms of an increase in plating area due to the profile of the laser ablated moulds.

Paper Details

Date Published: 21 November 2001
PDF: 8 pages
Proc. SPIE 4592, Device and Process Technologies for MEMS and Microelectronics II, (21 November 2001); doi: 10.1117/12.449006
Show Author Affiliations
Hengyi Jin, Swinburne Univ. of Technology (Australia)
Sam T. Davies, Univ. of Warwick (United Kingdom)
Muralihar K. Ghantasala, Swinburne Univ. of Technology (Australia)
Jason P. Hayes, Swinburne Univ. of Technology (Australia)
Erol C. Harvey, Swinburne Univ. of Technology (Australia)


Published in SPIE Proceedings Vol. 4592:
Device and Process Technologies for MEMS and Microelectronics II
Jung-Chih Chiao; Lorenzo Faraone; H. Barry Harrison; Andrei M. Shkel, Editor(s)

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