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Proceedings Paper

Enhanced performance of microbolometer using coupled feed horn antenna
Author(s): Kuntae Kim; Jong-Yeon Park; HoKwan Kang; Jong-Oh Park; Sung Moon; Jung-Ho Park
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Paper Abstract

In the paper, we improved the performance of the microbolometer using coupled feed horn antenna. The response time of the device was improved by reducing thermal time constant as the area of the absorption layer was reduced. We designed the shape of an absorption layer as circular structure in order to reduce the coupling loss between the antenna and the bolometer. A supporting leg for thermal isolation also has circular structure and its length increased up to 82micrometers , it reduced the thermal conductance to 4.65x 10-8[W/K]. The directivity of the designed antenna has 20.8dB. So the detectivity of the bolometer was improved to 2.37x 10-9 [cm ROOT(Hz)/W] as the noise characteristics of the bolometer was enhanced by coupling feed horn antenna. The fabrication of the bolometer are carried out by a surface micromachining method that uses a polyimide as a sacrificial layer. The absorption layer material of the bolometer is VOx and its TCR value has above 2%/K. The 3-D feed horn antenna structure can be constructed by using a PMER negative photoresist. The antenna and the bolometer can be bonded by Au-Au flip chip bonding method.

Paper Details

Date Published: 21 November 2001
PDF: 8 pages
Proc. SPIE 4592, Device and Process Technologies for MEMS and Microelectronics II, (21 November 2001); doi: 10.1117/12.448992
Show Author Affiliations
Kuntae Kim, Korea Institute of Science and Technology (South Korea)
Jong-Yeon Park, Korea Institute of Science and Technology (South Korea)
HoKwan Kang, Korea Institute of Science and Technology (South Korea)
Jong-Oh Park, Korea Institute of Science and Technology (South Korea)
Sung Moon, Korea Institute of Science and Technology (South Korea)
Jung-Ho Park, Korea Institute of Science and Technology (South Korea)


Published in SPIE Proceedings Vol. 4592:
Device and Process Technologies for MEMS and Microelectronics II
Jung-Chih Chiao; Lorenzo Faraone; H. Barry Harrison; Andrei M. Shkel, Editor(s)

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