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Proceedings Paper

Microsystem tool for microsystem characterization profile measurement of high-aspect-ratio microstructures
Author(s): Jean-Bernard Pourciel; Eric Lebrasseur; Tarik Bourouina; Takahisa Masuzawa; Hiroyuki Fujita
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Paper Abstract

A microsystem for the measurement of profiles of high aspect-ratio microstructures has been developed. This microsystem uses a silicon micro-probe with a sharp tip at its end and an integrated piezoresistive strain gauge force sensor. The probes are from 500 micrometers to 1 mm long with a cross-section of 20x20micrometers 2; they were previously mainly designed for the characterization of narrow and deep micro-holes having a radius as small as 50micrometers . The profile measurement method has been extended to the characterization of other microstructures. In a first part of this paper, we explain the method based on an original algorithm to measure profiles with the greatest precision and reproducibility. In a second part we give some information about the capabilities for horizontal and vertical profiles measurement, concave and convex surfaces profiles plotting. We conclude with some experimental results for several types of profiles.

Paper Details

Date Published: 21 November 2001
PDF: 8 pages
Proc. SPIE 4592, Device and Process Technologies for MEMS and Microelectronics II, (21 November 2001); doi: 10.1117/12.448973
Show Author Affiliations
Jean-Bernard Pourciel, LIMMS/CNRS/Univ. of Tokyo (Japan)
Eric Lebrasseur, LIMMS/CNRS/Univ. of Tokyo (Japan)
Tarik Bourouina, LIMMS/CNRS/Univ. of Tokyo (Japan)
Takahisa Masuzawa, Univ. of Tokyo (Japan)
Hiroyuki Fujita, Univ. of Tokyo (Japan)


Published in SPIE Proceedings Vol. 4592:
Device and Process Technologies for MEMS and Microelectronics II
Jung-Chih Chiao; Lorenzo Faraone; H. Barry Harrison; Andrei M. Shkel, Editor(s)

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