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Proceedings Paper

Micronanosystems by bulk silicon micromachining
Author(s): Masayoshi Esashi
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Paper Abstract

Wafer process packaging using electrical feedthrough from glass holes has been applied for micromechanical sensors as electrostatically levitating micro motors (10,000 rpm) for rotational gyroscopes. Active catheters and sensors have been developed as maintenance tools used in narrow space. Silicon microstructures made by the deep RIE was used as molds for making ceramic microstructures. Hydrogen storage capacity of carbon nanotube was measured from the resonant frequency change of thin silicon cantilever which have the carbon nanotube on it. Multiprobe data storage devices have been fabricated using thermal probes of which tip size is 30 nm. The electrical feedthrough from the multiprobe was fabricated in a Pyrex glass plate by using Deep RIE (Reactive Ion Etching) and nickel electroplating. High density data recording to a phase change media (GeSbTe) was performed.

Paper Details

Date Published: 21 November 2001
PDF: 8 pages
Proc. SPIE 4592, Device and Process Technologies for MEMS and Microelectronics II, (21 November 2001); doi: 10.1117/12.448971
Show Author Affiliations
Masayoshi Esashi, Tohoku Univ. (Japan)


Published in SPIE Proceedings Vol. 4592:
Device and Process Technologies for MEMS and Microelectronics II
Jung-Chih Chiao; Lorenzo Faraone; H. Barry Harrison; Andrei M. Shkel, Editor(s)

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