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Proceedings Paper

Packaging of the rf MEMS switch
Author(s): Heung-Woo Park; Yun-Kwon Park; Duck-Jung Lee; Byeong-Kwon Ju
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Paper Abstract

In this work, the flip-chip method was used for packaging of the RF-MEMS switch on the quartz substrate with low losses. The 4-inch Pyrex glass was used as a package substrate and it was punched with airblast with 250 micrometers diameter holes. The Cr/Au seed layer was deposited on it and the vias were filled with plating gold. After forming the molds on the holes with thick photoresist, the bumps were plated on holes. The package substrate was bonded with the quartz substrate with the B-stage epoxy. The loss of the overall package structure was tested with a network analyzer and was within -0.05 dB. This structure can be used for wafer level packaging of not only the RF-MEMS devices but also the MEMS devices.

Paper Details

Date Published: 19 November 2001
PDF: 10 pages
Proc. SPIE 4593, Design, Characterization, and Packaging for MEMS and Microelectronics II, (19 November 2001); doi: 10.1117/12.448864
Show Author Affiliations
Heung-Woo Park, Korea Institute of Science and Technology (South Korea)
Yun-Kwon Park, Korea Institute of Science and Technology (South Korea)
Duck-Jung Lee, Korea Institute of Science and Technology (South Korea)
Byeong-Kwon Ju, Korea Institute of Science and Technology (South Korea)


Published in SPIE Proceedings Vol. 4593:
Design, Characterization, and Packaging for MEMS and Microelectronics II
Paul D. Franzon; Ajay P. Malshe; Francis E.H. Tay, Editor(s)

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