Share Email Print
cover

Proceedings Paper

Design and simulation of a novel micromachined vibratory gyroscope with enhanced-sensitivity performance
Author(s): Rongming Lin; Zhe Wang; Kow Wah Leow; Mong Kim Lim; Uppili Sridhar; Yu Bo Miao; Hanhua Feng
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

In this paper, the vibration characteristics of 2-DOF mechanical vibration absorber system are adopted to improve the mechanical sensitivity of a micro-electro-mechanical (MEMS) vibratory gyroscope sensor. The proposed gyroscope is basically composed of two oscillating masses that are interconnected with flexures. It can be shown that, at their resonance, the secondary mass will absorb most of vibration energy from the primary mass, thus resulting in the vibration amplification that is directly related to the mass ratio between the masses. Therefore, when an angular velocity is applied to such a gyroscope, most of the energy gained due to Coriolis force is transmitted from the primary element to the secondary element. As the primary mass is normally designed to be much bigger than the secondary mass, the Coriolis displacement of the secondary element will be amplified depending on the mass ratio. With the use of the secondary oscillating mass as a capacitive sensing element, the mechanical sensitivity of the gyroscope can be increased significantly. Modelling and simulation of a practical gyroscope design were conducted using ANSYS54 finite element code. The results are presented and verified with the theory.

Paper Details

Date Published: 19 November 2001
PDF: 10 pages
Proc. SPIE 4593, Design, Characterization, and Packaging for MEMS and Microelectronics II, (19 November 2001); doi: 10.1117/12.448838
Show Author Affiliations
Rongming Lin, Nanyang Technological Univ. (Singapore)
Zhe Wang, Institute of Microelectronics (Singapore)
Kow Wah Leow, Nanyang Technological Univ. (Singapore)
Mong Kim Lim, Nanyang Technological Univ. (Singapore)
Uppili Sridhar, Institute of Microelectronics (Singapore)
Yu Bo Miao, Institute of Microelectronics (Singapore)
Hanhua Feng, Institute of Microelectronics (Singapore)


Published in SPIE Proceedings Vol. 4593:
Design, Characterization, and Packaging for MEMS and Microelectronics II
Paul D. Franzon; Ajay P. Malshe; Francis E.H. Tay, Editor(s)

© SPIE. Terms of Use
Back to Top