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Proceedings Paper

Design considerations of the biaxial frequency-shifted microaccelerometer
Author(s): Deng-Huei Hwang; Yi-Chung Lo; Kanping Chin
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Paper Abstract

By investigating microaccelerometers with various configurations including the amplitude type and the resonant type, we summarize that dynamic behavior, geometry, structure rigidity and dimension are important considerations to design a microaccelerometer. In which, a linear dynamic response is better for its easiness to be processed, and a significant variation tendency in responding to the detected acceleration is required. A good geometry is necessary to decouple a detected acceleration, such as a 2D or 3D acceleration into two or three measurable independent accelerations components. In addition, a strong rigidity and stiffness are necessary to avoid the influence, such as the associated crosstalk from other non-interested acceleration, e.g., gravitation. Moreover, the dimensions of the structural components dominate the mechanical and electrical sensitivity of the device. We utilize these considerations to design a biaxil frequency-shifted microaccelerometer. This accelerometer is configured with a central proof mass connected via four identical and symmetrical beams with high-aspect ratio, and operates using natural frequency shift of the microbeam. The good performance of the accelerometer is verified by using analytical simulation and FEA (Finite Element Analysis). Moreover, to achieve a most sensitive structure, the best dimension arrangement of 1:2 for the ratio of the microbeam to the proof mass is also realized.

Paper Details

Date Published: 19 November 2001
PDF: 10 pages
Proc. SPIE 4593, Design, Characterization, and Packaging for MEMS and Microelectronics II, (19 November 2001); doi: 10.1117/12.448837
Show Author Affiliations
Deng-Huei Hwang, National Chiao Tung Univ. (Taiwan)
Yi-Chung Lo, Synchrotron Radiation Research Ctr. (Taiwan)
Kanping Chin, National Chiao Tung Univ. (Taiwan)

Published in SPIE Proceedings Vol. 4593:
Design, Characterization, and Packaging for MEMS and Microelectronics II
Paul D. Franzon; Ajay P. Malshe; Francis E.H. Tay, Editor(s)

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