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Proceedings Paper

Novel testing scheme for selection of capacitive fingerprint sensor LSIs
Author(s): Toshishige Shimamura; Hiroki Morimura; Hideyuki Unno; Koji Fujii; Satoshi Shigematsu; Katsuyuki Machida; Hakaru Kyuragi
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Paper Abstract

We propose a novel testing scheme to select good chip of capacitive fingerprint sensor LSIs. Conventional testing uses actual finger touching. For mass production, accuracy, high speed, and low cost are needed in testing. To check the sensor LSI at the wafer level using an LSI tester, we add a self-testing function to each pixel in the sensor LSI. The pixel-self-check extracts error pixels whose output is abnormally fixed. These pixels degrade the fingerprint image. A fingerprint sensor LSI with the self-testing function was fabricated using the 0.5-micrometers CMOS process/sensor process. It demonstrates that the pixel-self-check extracts error pixels accurately. The proposed testing scheme enables the selection of good chips at the wafer level without finger touching.

Paper Details

Date Published: 19 November 2001
PDF: 8 pages
Proc. SPIE 4593, Design, Characterization, and Packaging for MEMS and Microelectronics II, (19 November 2001); doi: 10.1117/12.448833
Show Author Affiliations
Toshishige Shimamura, NTT Lifestyle and Environmental Technology Labs. (Japan)
Hiroki Morimura, NTT Lifestyle and Environmental Technology Labs. (Japan)
Hideyuki Unno, NTT Lifestyle and Environmental Technology Labs. (Japan)
Koji Fujii, NTT Lifestyle and Environmental Technology Labs. (Japan)
Satoshi Shigematsu, NTT Lifestyle and Environmental Technology Labs. (Japan)
Katsuyuki Machida, NTT Telecommunications Energy Labs. (Japan)
Hakaru Kyuragi, NTT Telecommunications Energy Labs. (Japan)


Published in SPIE Proceedings Vol. 4593:
Design, Characterization, and Packaging for MEMS and Microelectronics II
Paul D. Franzon; Ajay P. Malshe; Francis E.H. Tay, Editor(s)

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