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Proceedings Paper

VCSEL arrays for CMOS integrated optical interconnect systems
Author(s): Rainer Michalzik; Roger King; Roland Jaeger; Steffen Mueller; Karl Joachim Ebeling
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Paper Abstract

We report on the fabrication of two-dimensional vertical- cavity surface-emitting laser (VCSEL) arrays designed for flip-chip integration with silicon complementary metal-oxide semiconductor (CMOS) circuits. Devices emitting at 980 nm wavelength show single-mode output powers of 3 mW, modulation current efficiencies up to 10 GHz/(root)mA, and are suitable for digital data transmission at 12.5 Gb/s. The chips are incorporated into optical area interconnect system demonstrators employing plastic optical fiber bundles as waveguiding medium. Substrate removal is applied as a possible route toward the production of modules compatible to the standard 850 nm wavelength regime. Fully pretested and mechanically robust arrays for short-wavelength bottom emission are alternatively demonstrated by providing light outcoupling holes in the GaAs substrate.

Paper Details

Date Published: 8 November 2001
PDF: 13 pages
Proc. SPIE 4534, Optoelectronic and Wireless Data Management, Processing, Storage, and Retrieval, (8 November 2001); doi: 10.1117/12.448006
Show Author Affiliations
Rainer Michalzik, Univ. Ulm (Germany)
Roger King, Univ. Ulm and ULM Photonics GmbH (Germany)
Roland Jaeger, Univ. Ulm (Germany)
Steffen Mueller, ULM Photonics GmbH (Germany)
Karl Joachim Ebeling, Univ. Ulm and Infineon Technologies AG (Germany)


Published in SPIE Proceedings Vol. 4534:
Optoelectronic and Wireless Data Management, Processing, Storage, and Retrieval
Robert Raymond; Pradip K. Srimani; Renjeng Su; Carl W. Wilmsen, Editor(s)

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