Share Email Print
cover

Proceedings Paper

Advances in light curing adhesives
Author(s): Andy Bachmann
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

This paper describes the development of a new family of light curing adhesives containing a new reactive additive previously not used in optical grade light curing adhesives are obtained with the addition of functionalized cellulositics. Outgassing as low as 10-6 grams/gram has been observed based on headspace sampling. Other additives have lowered the shrinkage rates of positioning adhesives from near 1 percent to less than 0.1 percent with fractional, percentage movements over thermal range of -40 degrees C to +200 degrees C.

Paper Details

Date Published: 5 November 2001
PDF: 11 pages
Proc. SPIE 4444, Optomechanical Design and Engineering 2001, (5 November 2001); doi: 10.1117/12.447301
Show Author Affiliations
Andy Bachmann, Dymax Corp. (United States)


Published in SPIE Proceedings Vol. 4444:
Optomechanical Design and Engineering 2001
Alson E. Hatheway, Editor(s)

© SPIE. Terms of Use
Back to Top