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Proceedings Paper

Advances in light curing adhesives
Author(s): Andy Bachmann
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Paper Abstract

This paper describes the development of a new family of light curing adhesives containing a new reactive additive previously not used in optical grade light curing adhesives are obtained with the addition of functionalized cellulositics. Outgassing as low as 10-6 grams/gram has been observed based on headspace sampling. Other additives have lowered the shrinkage rates of positioning adhesives from near 1 percent to less than 0.1 percent with fractional, percentage movements over thermal range of -40 degrees C to +200 degrees C.

Paper Details

Date Published: 5 November 2001
PDF: 11 pages
Proc. SPIE 4444, Optomechanical Design and Engineering 2001, (5 November 2001); doi: 10.1117/12.447301
Show Author Affiliations
Andy Bachmann, Dymax Corp. (United States)


Published in SPIE Proceedings Vol. 4444:
Optomechanical Design and Engineering 2001
Alson E. Hatheway, Editor(s)

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