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Proceedings Paper

Data integrator for ground sensors (DIGS)
Author(s): Steven Streetman; Charles D. Carleton; Robertson G. Hamrick; Matthew McGarvey
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Paper Abstract

We demonstrate an operationally ready system for multi-sensor command and control, display, fusion, and analysis. The demonstration will show integration of seismic, acoustic, passive infrared, magnetic, electromagnetic, electro-optical, and special purpose sensors in an operational scenario against time-critical targets and underground facilities. Unlike other proposed ground stations, DIGS is capable of performing automated target identification, location, and characterization based on all the accumulated evidence from the entire sensor field using a hybrid expert system classifier and a configurable characterization mechanism. These automated capabilities are made possible by operating primarily under an event model rather than a sensor detection model of site activity. DIGS provides all necessary displays for operations including event displays, detailed information, sensor status, sensor control, and a GIS-based map display. In addition, DIGS provides analysis tools to calculate array bearings and Time Difference of Arrival (TDOA) locations, and perform signal analysis of time series or spectral data. DIGS provides an additional layer of fusion to analyze the behavior of targets over time. DIGS is capable of accepting numerous data types including feature vectors, identifications, simple alarms, spectral data, pictures, video, biological and chemical agent information, frequency information, and raw time series data.

Paper Details

Date Published: 7 August 2002
PDF: 7 pages
Proc. SPIE 4743, Unattended Ground Sensor Technologies and Applications IV, (7 August 2002); doi: 10.1117/12.447196
Show Author Affiliations
Steven Streetman, ENSCO, Inc. (United States)
Charles D. Carleton, ENSCO, Inc. (United States)
Robertson G. Hamrick, ENSCO, Inc. (United States)
Matthew McGarvey, ENSCO, Inc. (United States)


Published in SPIE Proceedings Vol. 4743:
Unattended Ground Sensor Technologies and Applications IV
Edward M. Carapezza, Editor(s)

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