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Proceedings Paper

Experimental methods for thermomechanical characterization of electronic packages: a review and evaluation
Author(s): Fei Su; Sung Yi; Fulong Dai; Huimin Xie; Mehu Vora; Xiaoyuan He
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Paper Abstract

The mechanical reliability of electronic packaging is a topic of concern. Characterization of the thermo-mechanical behavior including the thermal stress/strain of electronic packages is critical for this topic. In this paper, current principal experimental methods used for this purpose are reviewed, their advantages and disadvantages are analyzed, also their newest applications are introduced. The hybrid method that takes the advantage of experimental methods and finite elemental method -- FEM is pointed out to be the best investigation method and represents a developing direction.

Paper Details

Date Published: 16 October 2001
PDF: 11 pages
Proc. SPIE 4602, Semiconductor Optoelectronic Device Manufacturing and Applications, (16 October 2001); doi: 10.1117/12.445732
Show Author Affiliations
Fei Su, Nanyang Technological Univ. (Singapore)
Sung Yi, Nanyang Technological Univ. (Singapore)
Fulong Dai, Nanyang Technological Univ. (China)
Huimin Xie, Nanyang Technological Univ. (Singapore)
Mehu Vora, Nanyang Technological Univ. (Singapore)
Xiaoyuan He, Southeast Univ. (China)

Published in SPIE Proceedings Vol. 4602:
Semiconductor Optoelectronic Device Manufacturing and Applications

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