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Proceedings Paper

Microphotogrammetry for 3D strain measurement and microassembly control
Author(s): Rainer Tutsch; Reinhold Ritter; Diana Ispas; Marcus Petz; Leobaldo Casarotto
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Paper Abstract

In photogrammetry several images of an object taken from different positions in space, are combined to calculate 3D geometrical data. This concept can be scaled down to dimensions in the mm or sub-mm regime. In this paper the application of microphotogrammetry for the measurement of strain fields in material testing is presented. The working principle and an experimental measurement setup are described and results of two application examples are given. Microphotogrammetry is compared with speckle-interferometry as an alternative approach for strain field measurement. As an additional implementation of the microphotogrammetric approach the current state of development of a precision assembly system with a positioning control using CCD-cameras is discussed.

Paper Details

Date Published: 23 October 2001
PDF: 9 pages
Proc. SPIE 4400, Microsystems Engineering: Metrology and Inspection, (23 October 2001); doi: 10.1117/12.445602
Show Author Affiliations
Rainer Tutsch, Technische Univ. Braunschweig (Germany)
Reinhold Ritter, Technische Univ. Braunschweig (Germany)
Diana Ispas, Technische Univ. Braunschweig (Germany)
Marcus Petz, Technische Univ. Braunschweig (Germany)
Leobaldo Casarotto, Technische Univ. Braunschweig (Germany)

Published in SPIE Proceedings Vol. 4400:
Microsystems Engineering: Metrology and Inspection
Christophe Gorecki; Werner P. O. Jueptner; Malgorzata Kujawinska, Editor(s)

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