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Proceedings Paper

Coupling paths in multilayer printed circuit boards for electromagnetic interference and immunity: experiments and FDTD modeling
Author(s): Wei Cui; Daniel P. Berg; James L. Drewniak; Richard E. DuBroff
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Paper Abstract

Electromagnetic emissions from electronics associated with explosives is a potential detection modality, both passive listening, and stimulated RF emissions. However, the parasitic paths by which energy is coupled off a printed circuit board from an active device, and by which external energy can be coupled onto the board and to a device, must be identified and characterized. One such noise-coupling path is identified in this work, and a modeling approach demonstrated. In particular, coupling of noise from the DC power bus of a multilayer printed circuit board that uses entire metal layers for power and ground, and an I/O line that transitions through the DC power planes is investigated.

Paper Details

Date Published: 18 October 2001
PDF: 7 pages
Proc. SPIE 4394, Detection and Remediation Technologies for Mines and Minelike Targets VI, (18 October 2001); doi: 10.1117/12.445464
Show Author Affiliations
Wei Cui, Univ. of Missouri/Rolla (United States)
Daniel P. Berg, Univ. of Missouri/Rolla (United States)
James L. Drewniak, Univ. of Missouri/Rolla (United States)
Richard E. DuBroff, Univ. of Missouri/Rolla (United States)


Published in SPIE Proceedings Vol. 4394:
Detection and Remediation Technologies for Mines and Minelike Targets VI
Abinash C. Dubey; James F. Harvey; J. Thomas Broach; Vivian George, Editor(s)

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