Share Email Print
cover

Proceedings Paper

Coupling paths in multilayer printed circuit boards for electromagnetic interference and immunity: experiments and FDTD modeling
Author(s): Wei Cui; Daniel P. Berg; James L. Drewniak; Richard E. DuBroff
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Electromagnetic emissions from electronics associated with explosives is a potential detection modality, both passive listening, and stimulated RF emissions. However, the parasitic paths by which energy is coupled off a printed circuit board from an active device, and by which external energy can be coupled onto the board and to a device, must be identified and characterized. One such noise-coupling path is identified in this work, and a modeling approach demonstrated. In particular, coupling of noise from the DC power bus of a multilayer printed circuit board that uses entire metal layers for power and ground, and an I/O line that transitions through the DC power planes is investigated.

Paper Details

Date Published: 18 October 2001
PDF: 7 pages
Proc. SPIE 4394, Detection and Remediation Technologies for Mines and Minelike Targets VI, (18 October 2001); doi: 10.1117/12.445464
Show Author Affiliations
Wei Cui, Univ. of Missouri/Rolla (United States)
Daniel P. Berg, Univ. of Missouri/Rolla (United States)
James L. Drewniak, Univ. of Missouri/Rolla (United States)
Richard E. DuBroff, Univ. of Missouri/Rolla (United States)


Published in SPIE Proceedings Vol. 4394:
Detection and Remediation Technologies for Mines and Minelike Targets VI
Abinash C. Dubey; James F. Harvey; J. Thomas Broach; Vivian George, Editor(s)

© SPIE. Terms of Use
Back to Top