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Proceedings Paper

ICC silicon microbolometer development program
Author(s): Kevin Charles Liddiard; Jonathan P. Knauth; Steven M. Balick; Bai Xu; Nigel Robinson
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Paper Abstract

Infrared Components Corporation (ICC) recently announced that the company had acquired rights to uncooled microbolometer technology developed at the Defence Science and Technology Organization (DSTO), Australia. Under the license agreement DSTO is developing a technology transfer package for implementation in a silicon MEMS foundry. ICC has contracted Electro-optic Sensor Design (EOSD) for FPA design and analysis and local co-ordination of the technology transfer program. ICC has also entered into an agreement with SUNY Albany Center for Advanced Thin Film Technology (ACATFT) to transition the DSTO technology to production. In this paper we outline the microbolometer processing technology and discuss the aims and objectives of the ICC program.

Paper Details

Date Published: 10 October 2001
PDF: 7 pages
Proc. SPIE 4369, Infrared Technology and Applications XXVII, (10 October 2001); doi: 10.1117/12.445298
Show Author Affiliations
Kevin Charles Liddiard, Electro-optic Sensor Design (Australia)
Jonathan P. Knauth, Infrared Components Corp. (United States)
Steven M. Balick, Infrared Components Corp. (United States)
Bai Xu, SUNY/Albany (United States)
Nigel Robinson, Defence Science and Technology Organisation (Australia)

Published in SPIE Proceedings Vol. 4369:
Infrared Technology and Applications XXVII
Bjorn F. Andresen; Gabor F. Fulop; Marija Strojnik, Editor(s)

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