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Proceedings Paper

Mixed application MMIC technologies: progress in combining RF, digital, and photonic circuits
Author(s): Stan E. Swirhun; Mark P. Bendett; Vladimir Sokolov; Paul E. Bauhahn; Charles T. Sullivan; R. Mactaggart; Sayan D. Mukherjee; Mary K. Hibbs-Brenner; J. P. Mondal
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Paper Abstract

Approaches for future 'mixed application' monolithic integrated circuits (ICs) employing optical receive/transmit, RF amplification and modulation and digital control functions are discussed. We focus on compatibility of the photonic component fabrication with conventional RF and digital IC technologies. Recent progress at Honeywell in integrating several parts of the desired RF/digital/photonic circuit integration suite required for construction of a future millimeter-wave optically-controlled phased-array element are illustrated.

Paper Details

Date Published: 1 July 1991
PDF: 8 pages
Proc. SPIE 1475, Monolithic Microwave Integrated Circuits for Sensors, Radar, and Communications Systems, (1 July 1991); doi: 10.1117/12.44499
Show Author Affiliations
Stan E. Swirhun, Honeywell Systems and Research Ctr. (United States)
Mark P. Bendett, Honeywell Systems and Research Ctr. (United States)
Vladimir Sokolov, Honeywell Systems and Research Ctr. (United States)
Paul E. Bauhahn, Honeywell Systems and Research Ctr. (United States)
Charles T. Sullivan, Honeywell Systems and Research Ctr. (United States)
R. Mactaggart, Honeywell Systems and Research Ctr. (United States)
Sayan D. Mukherjee, Honeywell Systems and Research Ctr. (United States)
Mary K. Hibbs-Brenner, Honeywell Systems and Research Ctr. (United States)
J. P. Mondal, Honeywell Systems and Research Ctr. (United States)


Published in SPIE Proceedings Vol. 1475:
Monolithic Microwave Integrated Circuits for Sensors, Radar, and Communications Systems
Regis F. Leonard; Kul B. Bhasin, Editor(s)

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