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Proceedings Paper

Surface relief of TiNiCu thin films
Author(s): Xiulan Cheng; Dong Xu; Bingchu Cai; Li Wang; Jian Chen; Gang Li; Shi Xu
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Paper Abstract

TiNiCu thin film shape memory alloys are potential materials for microactuator. In our previous research, the various natural surface relief of crystallized TiNiCu thin film was observed, and it was related with compositions and the sputtering deposition conditions. In order to understand the origin and nature of the surface relief, the temperature-resistance measurement, X-ray diffraction and atomic fore microscopic study were performed. For Ti48.4Ni46.3Cu5.3 thin films, the transformation temperatures are below 0 degree(s)C, and the natural surface is smooth at 12 degree(s)C since the microstructure is austenite. For Ti51Ni44Cu5 thin films, two typical kinds of surface relief, e.g., chrysanthemum and rock candy, were observed at 12 degree(s)C. The chrysanthemum on the martensitic block relief is Ti-rich G.P. zone and will not disappear in thermal cycles later. It is also found that the Ti-rich G.P. zone is related with the thin films formed under lower sputtering Ar pressure. The rock candy relief is a typical martensite surface relief and will disappear when heating to the austenite phase. During crystallization process, the inherent compressive stress introduced under the condition of higher sputtering pressure is helpful to the transition from G.P. zones to Ti2(NiCu) precipitates and the increase of the transformation temperatures.

Paper Details

Date Published: 15 October 2001
PDF: 6 pages
Proc. SPIE 4601, Micromachining and Microfabrication Process Technology and Devices, (15 October 2001); doi: 10.1117/12.444731
Show Author Affiliations
Xiulan Cheng, Shanghai Jiao Tong Univ. (China)
Dong Xu, Shanghai Jiao Tong Univ. (China)
Bingchu Cai, Shanghai Jiao Tong Univ. (China)
Li Wang, Shanghai Jiao Tong Univ. (China)
Jian Chen, Shanghai Jiao Tong Univ. (Singapore)
Gang Li, Shanghai Jiao Tong Univ. (China)
Shi Xu, Shanghai Jiao Tong Univ. (China)


Published in SPIE Proceedings Vol. 4601:
Micromachining and Microfabrication Process Technology and Devices

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