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Proceedings Paper

Semiwafer metrology project
Author(s): Marylyn Hoy Bennett; William Mark Hiatt; Laurie J. Lauchlan; Lynda Clark Hannemann-Mantalas; Hans Rottmann; Mark A. Seliger; Bhanwar Singh; Don E. Yansen
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Paper Abstract

A wafer metrology 'round robin' has been completed comparing linewidth measurements from several different companies and different measurement tools and technologies. The project has been conducted under the auspices of SEMI by members of SEMI's Metrology Committee. The goals of the program were: (1) determine the range of critical dimension values measured across the United States, (2) test the newly formulated SEMI linewidth patterns, (3) assess the effect of calibration differences of the measured values.

Paper Details

Date Published: 1 July 1991
PDF: 10 pages
Proc. SPIE 1464, Integrated Circuit Metrology, Inspection, and Process Control V, (1 July 1991); doi: 10.1117/12.44472
Show Author Affiliations
Marylyn Hoy Bennett, Texas Instruments Inc. (United States)
William Mark Hiatt, Motorola, Inc. (United States)
Laurie J. Lauchlan, IBM/East Fishkill Facility (United States)
Lynda Clark Hannemann-Mantalas, Prometrix Corp. (United States)
Hans Rottmann, IBM/East Fishkill Facility (United States)
Mark A. Seliger, Digital Equipment Corp. (United States)
Bhanwar Singh, Advanced Micro Devices, Inc. (United States)
Don E. Yansen, BIO-RAD Labs., Inc. (United States)

Published in SPIE Proceedings Vol. 1464:
Integrated Circuit Metrology, Inspection, and Process Control V
William H. Arnold, Editor(s)

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