Share Email Print

Proceedings Paper

Electrochemical studies of electrodeposition of nickel for LIGA microstructures
Author(s): Guifu Ding; Yi Zhang; Jingquan Liu; Xiaolin Zhao; Bingchu Cai; Tianhui Shen
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

The comparison of Nickel electrodeposition in LIGA process with traditional electroplating by electrochemical methods was reported. The mass transport limitation during microelectroforming in LIGA was studied by linear potential sweep technique, the limiting current is easier to reach for plating into LIGA molds. The A.C. impedance measurement also supports the above viewpoint, beside this, it seems that the mechanism of electrode reaction also differ from that of conventional nickel plating. A semi-automatic electroforming equipment for LIGA process has been developed, various nickel microstructures with high aspect ratios have been fabricated in this equipment. a series of micro nickel gears have been fabricated, an advanced micro gear-box with 2mm diameter has been assembled, it works very well.

Paper Details

Date Published: 15 October 2001
PDF: 6 pages
Proc. SPIE 4601, Micromachining and Microfabrication Process Technology and Devices, (15 October 2001); doi: 10.1117/12.444706
Show Author Affiliations
Guifu Ding, Shanghai Jiao Tong Univ. (China)
Yi Zhang, Shanghai Jiao Tong Univ. (China)
Jingquan Liu, Shanghai Jiao Tong Univ. (China)
Xiaolin Zhao, Shanghai Jiao Tong Univ. (China)
Bingchu Cai, Shanghai Jiao Tong Univ. (China)
Tianhui Shen, Shanghai Jiao Tong Univ. (China)

Published in SPIE Proceedings Vol. 4601:
Micromachining and Microfabrication Process Technology and Devices
Norman C. Tien; Qing-An Huang, Editor(s)

© SPIE. Terms of Use
Back to Top