Share Email Print
cover

Proceedings Paper

Automated wafer inspection in the manufacturing line
Author(s): Jeanne E. Harrigan; Meryl D. Stoller
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Patterned wafer defect inspection has evolved from manual to automated wafer inspection equipment. The success of certain applications (and resulting yield improvement) using automated wafer inspection equipment is well documented. Automated wafer inspection equipment currently in use in the semiconductor industry has primarily been utilized in engineering analysis applications. Advances in inspection technology now allow for automated wafer inspection to become a more integral part of the manufacturing strategy. As automated wafer inspection becomes more widespread in the manufacturing line, data analysis issues specific to automated wafer inspection arise. This paper describes general patterned wafer inspection applications and associated requirements in terms of ensuring the quality of data generated. Techniques to help the user more efficiently gather and use defect data are presented. Key equipment characteristics needed for each application are then reviewed.

Paper Details

Date Published: 1 July 1991
PDF: 6 pages
Proc. SPIE 1464, Integrated Circuit Metrology, Inspection, and Process Control V, (1 July 1991); doi: 10.1117/12.44470
Show Author Affiliations
Jeanne E. Harrigan, IBM Corp. (United States)
Meryl D. Stoller, KLA Instruments Corp. (United States)


Published in SPIE Proceedings Vol. 1464:
Integrated Circuit Metrology, Inspection, and Process Control V
William H. Arnold, Editor(s)

© SPIE. Terms of Use
Back to Top