Share Email Print
cover

Proceedings Paper

Fabrication of high-aspect-ratio microstructure on metallic substrate using SU-8 resist
Author(s): Jingquan Liu; Bingchu Cai; Jun Zhu; Guipu Ding; Xiaolin Zhao; Chunsheng Yang; Di Chen
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

SU-8 is a negative, epoxy type, near-UV photoresist. The resist has been specifically developed for ultrathick, high-aspect-ratio MEMS-type applications. The adhesion of the SU-8 resist with the metallic substrate is very poor, but it is necessary to overcome this shortcoming for providing low-cost LIGA-type process in MEMS applications. In this paper, several metallic films are used as the substrates. The Ti film with oxidation treatment is found to have the strongest adhesion to the resist. SU-8 resist has been proven to be very sensitive to process variations, so the experimental optimizing technique is used in the process. Using processing parameters as control factors, experiments are performed and results are evaluated. As the results being analyzed, a proposed fabrication process is derived from optimizing the control factors. The output structure has straight sidewall profile, fine line and space resolution. The aspect ratio is greater than 20.

Paper Details

Date Published: 15 October 2001
PDF: 5 pages
Proc. SPIE 4601, Micromachining and Microfabrication Process Technology and Devices, (15 October 2001); doi: 10.1117/12.444698
Show Author Affiliations
Jingquan Liu, Shanghai Jiao Tong Univ. (China)
Bingchu Cai, Shanghai Jiao Tong Univ. (China)
Jun Zhu, Shanghai Jiao Tong Univ. (China)
Guipu Ding, Shanghai Jiao Tong Univ. (China)
Xiaolin Zhao, Shanghai Jiao Tong Univ. (China)
Chunsheng Yang, Shanghai Jiao Tong Univ. (China)
Di Chen, Shanghai Jiao Tong Univ. (China)


Published in SPIE Proceedings Vol. 4601:
Micromachining and Microfabrication Process Technology and Devices

© SPIE. Terms of Use
Back to Top