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Proceedings Paper

Thermal time constants of VLSI circuits
Author(s): Andrzej Kos
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Paper Abstract

The aim of the paper is to present the estimation of thermal time constants of various substrates of integrated circuits. The investigation leads to unexpected results, which show that materials having good thermal conductivity are recognized as not so good in aspect of thermal dynamics. The theoretical procedure carried out step-by-step leads to unsteady state temperature computation and thermal time constants calculation. It can be helpful for determination whether a chip is able to overcome so big deal of energy dissipated in expected short period of time. The comparison of thermal time constants of substrates or heat sinks made of various materials is included.

Paper Details

Date Published: 15 October 2001
PDF: 10 pages
Proc. SPIE 4600, Advances in Microelectronic Device Technology, (15 October 2001); doi: 10.1117/12.444669
Show Author Affiliations
Andrzej Kos, Univ. of Mining and Metallurgy (Poland)

Published in SPIE Proceedings Vol. 4600:
Advances in Microelectronic Device Technology
Qin-Yi Tong; Ulrich M. Goesele, Editor(s)

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