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Proceedings Paper

Cladding layer for photonic integrated circuits
Author(s): Chih-Wei Hsu; Way-Seen Wang; Hsuen-Li Chen; Tzyy-Jiann Wang; Yan Hao Huang
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Paper Abstract

Characterization results of cladding layer for photonic integrated circuits are present. The silicon oxide films were deposited by various methods. The mechanical stress, depending upon the methods of film deposition, had been measured. TEOS silicon oxide exhibited large mechanical stress. The stress of polymer benzocyclobutene (BCB) was also measured. Its stress is only 29 MPa. The roughness of BCB surface is 1.18 nm. The mode profiles of planar waveguide were calculated.

Paper Details

Date Published: 16 October 2001
PDF: 6 pages
Proc. SPIE 4603, Fiber Optics and Optoelectronics for Network Applications, (16 October 2001); doi: 10.1117/12.444564
Show Author Affiliations
Chih-Wei Hsu, National Taiwan Univ. (Taiwan)
Way-Seen Wang, National Taiwan Univ. (Taiwan)
Hsuen-Li Chen, National Nano Device Lab. (Taiwan)
Tzyy-Jiann Wang, National Taipei Univ. of Technology (Taiwan)
Yan Hao Huang, National Taipei Univ. of Technology (Taiwan)


Published in SPIE Proceedings Vol. 4603:
Fiber Optics and Optoelectronics for Network Applications

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