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Proceedings Paper

Applications of an automated particle detection and identification system in VLSI wafer processing
Author(s): Takeshi Hattori; Sakuo Koyata
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Paper Abstract

Identifying particulate sources at an intermediate stage in the VLSI manufacturing process is frequently indispensable for taking the appropriate corrective action, and thereby enhancing device yield. To rapidly locate and analyze both organic and inorganic particles on a large silicon wafer, the authors have developed an automated wafer-surface particle detection and identification system that consists of a laser-scanning wafer inspection unit, an SEM/EDX unit, a microfluorescence spectroscopy unit, and a computing unit for file conversion and XY-coordinate transformation. Examples of successful applications of a particle inspection and analysis program using this new system in VLSI wafer processing are presented. With emphasis on photolithography and the subsequent processes such as ion implantation and dry etching.

Paper Details

Date Published: 1 July 1991
PDF: 10 pages
Proc. SPIE 1464, Integrated Circuit Metrology, Inspection, and Process Control V, (1 July 1991); doi: 10.1117/12.44449
Show Author Affiliations
Takeshi Hattori, Sony Corp. (Japan)
Sakuo Koyata, Sony Corp. (Japan)


Published in SPIE Proceedings Vol. 1464:
Integrated Circuit Metrology, Inspection, and Process Control V
William H. Arnold, Editor(s)

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