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Proceedings Paper

Using the Atomic Force Microscope to measure submicron dimensions of integrated circuit devices and processes
Author(s): Mark R. Rodgers; Kevin M. Monahan
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Paper Abstract

Decreasing dimensions in the processing and manufacture of integrated circuits (ICs) has stimulated interest in ultra-high resolution measuring technologies. The Atomic Force Microscope (AFM), which is now available commercially, offers three-dimensional surface measurement capability from angstroms to over 100 microns, the ability to image insulators directly without coating, and minimal sample preparation. These features indicate strong potential for applications in IC related inspection, process engineering, failure analysis and reliability, particularly as ICs move toward submicron geometries.

Paper Details

Date Published: 1 July 1991
PDF: 9 pages
Proc. SPIE 1464, Integrated Circuit Metrology, Inspection, and Process Control V, (1 July 1991); doi: 10.1117/12.44448
Show Author Affiliations
Mark R. Rodgers, Digital Instruments Inc. (United States)
Kevin M. Monahan, Metrologix, Inc. (United States)

Published in SPIE Proceedings Vol. 1464:
Integrated Circuit Metrology, Inspection, and Process Control V
William H. Arnold, Editor(s)

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