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Proceedings Paper

Three-dimensional microstructuring of Pyrex glass wafers by spark-assisted chemical etching
Author(s): Hans H. Langen; V. Fascio; R. Wuethrich; D. Viquerat
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Paper Abstract

A fabrication technology is introduced for rapid structuring of glass components with microtools. The machining occurs in the vicinity of the tool tip in a NaOH solution without the necessity of mask design and lithography steps. The whole setup can be arranged on a table top unit outside the clean room. Especially the research field of MEMS or (mu) TAS could profit from this technology. The micro structures are drilled or milled into the glass substrates by spark assisted chemical etching (SACE) using micro tools that are dressed on the machine itself to correct for errors due to tool mounting (eccentricity and attitude). This tool processing is done with wire electrodischarge grinding (WEDG). A newly developed prototype is introduced that reduces the development time of micro devices that make use of glass components (Pyrex glass or quartz). Some research results on SACE are presented.

Paper Details

Date Published: 8 October 2001
PDF: 6 pages
Proc. SPIE 4568, Microrobotics and Microassembly III, (8 October 2001); doi: 10.1117/12.444139
Show Author Affiliations
Hans H. Langen, Swiss Federal Institute of Technology (Switzerland)
V. Fascio, Swiss Federal Institute of Technology (Switzerland)
R. Wuethrich, Swiss Federal Institute of Technology (Switzerland)
D. Viquerat, Swiss Federal Institute of Technology (Switzerland)

Published in SPIE Proceedings Vol. 4568:
Microrobotics and Microassembly III
Bradley J. Nelson; Jean-Marc Breguet, Editor(s)

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